TENG, Hsien-yu; TIEN, Ya-chieh. Supply Chain Software Package Risk Scoring TD3-MPC Model Based on Dependency Metadata Graph. Journal of Applied Automation Technologies, [S. l.], v. 4, p. 31e:413–425, 2026. DOI: 10.64972/jaat.2026v4.386p31e:413-425. Disponível em: http://www.wpias.edu.pl/ojs/index.php/JAAT/article/view/386. Acesso em: 31 aug. 2026.